Optical Packaging – Assembly Engineer

Develop and implement optical packaging and assembly processes for integrated photonic devices, including high-precision active alignment to achieve optimal coupling efficiency and long-term stability

Design, validate, and optimize alignment methods and tooling to improve accuracy, throughput, and repeatability

Establish validation plans and characterize optical performance under relevant operating conditions

Define scalable workflows, SOPs, and process controls to ensure consistent manufacturing outcomes

Support New Product Introduction by partnering with design, device, test, and manufacturing teams to apply Design for Excellence methodologies, including Design for Manufacturability, Design for Test, and Design for Reliability

Develop assembly stations integrating precision motion, optical metrology, and environmental control

Analyze assembly, process, and test data to identify yield drivers, root causes, failure mechanisms, and opportunities for improved throughput, repeatability, and stability

Collaborate across teams to develop robust, manufacturable packaging solutions

Define qualification criteria and acceptance standards to support product release

Requirements PhD or Master’s degree in physics, applied physics, packaging engineering, electrical engineering, or other relevant discipline

Knowledge of and hands-on-experience with integrated photonics and optics

3+ years of experience with photonic integrated circuit, semiconductor, optoelectronic, fiber optic, or related packaging design & qualification

Working experience in new product introduction

Excellent teamwork, interpersonal and written communication skills

Good organization and problem solving skills

Strong attention to detail

Deep hands-on expertise in high-precision optical alignment and packaging for Photonic Integrated Circuits

Proven ability to translate research-grade photonic assemblies into robust, production-ready assembly processes

Strong experience in data-driven process optimization including analyzing large datasets to identify yield drivers, diagnose failure mechanisms, and improve process stability

Demonstrated contribution to New Product Introduction (NPI) and experience in Design for Excellence (DfX) methodologies with focus on Design for Manufacturability (DfM), Design for Test (DfT), and Design for Reliability (DfR)

Cover letter with resume in one file

Core Competencies Demonstrates expertise in developing and implementing optical packaging processes for integrated photonic devices, with a strong focus on high-precision optical alignment and data-driven process optimization. Proven ability to collaborate across teams and apply Design for Excellence methodologies to ensure robust, manufacturable solutions.

Highest-signal resume keywords PhD Or Master’s Degree In Physics

Integrated Photonics And Optics

High-Precision Optical Alignment

Data-Driven Process Optimization

New Product Introduction (NPI)

Hard Skills Optical Packaging Processes

Alignment Methods And Tooling

Optical Performance Characterization

Process Controls And SOPs

Photonic Integrated Circuit Design

Semiconductor Packaging Design

Optoelectronic Packaging

Fiber Optic Packaging

Data Analysis For Yield Improvement

Design For Excellence (DfX) Methodologies

Soft Skills Teamwork

Interpersonal Communication

Written Communication

Organization

Problem Solving

Attention To Detail

Industry Keywords Photonic Integrated Circuits

Packaging Engineering

Design For Manufacturability (DfM)

Design For Test (DfT)

Design For Reliability (DfR)

Tools & Technologies Precision Motion Systems

Optical Metrology

Environmental Control Systems

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